2026 Global Internship - Package Solution Hardware Development - Advanced/Product Development (International students at domestic universities. Bachelor's, Master's, and Ph.D.)

Job Description

The Advanced/Product Development role involves developing products that meet customer specifications or creating new product types capable of leading the market, and then proposing them to clients. Additionally, this role involves setting the direction for securing the company's unique technological competitiveness by analyzing global trends of key products, and carrying out tasks ranging from actual product manufacturing and performance evaluation to customer promotion. A major advantage is the ability to rapidly experience the sense of accomplishment and personal growth when successfully completing numerous projects through persistent research and study with colleagues. - Development of key semiconductor substrate products, core technology development, new manufacturing processes, and materials development * Major Package Substrate product lines such as FCBGA, FCCSP, CSP, RF-SiP, AiP, and AP modules * Key manufacturing processes/technologies including Fine Pattern, Small via, ETS/SAP/mSAP, photolithography, plating, surface treatment, raw material development/optimization/reliability assurance, and interlayer alignment precision control (Alignment) - Product defect analysis/evaluation, characteristic simulation, and responding to customer technical meetings, etc.

Qualifications

- Basic understanding of engineering, product development, and construction methods - Foreign nationals or foreign citizens currently enrolled in a domestic university's Bachelor's program (3rd year or higher) or Master's/Doctoral program, or holders of a degree (graduates and those expected to graduate in August 2026 are eligible to apply) - Holders of the Test of Korean Language Proficiency (TOPIK) Levels 4–6 ※ Valid for 2 years - Holders of or capable of acquiring a visa status for the internship (July–August 2026) (D-2, D-10, F-series visas, etc.) - Preference given to Government-sponsored Foreign Student Scholars (GKS) and those who have completed Level 5 of the Korean Inclusive Social Integration Program (KIIP) - Preference given to candidates with excellent language skills (capable of business communication): English, Vietnamese, Chinese, Spanish, Polish, Indonesian, etc. ※ Due to the high volume of applications and inquiries on the announcement deadline, please complete your submission before the deadline if possible. Additional registrations and modifications are not possible after the deadline, so please ensure you submit well in advance. (Please complete registration inquiries by 3 days prior to the deadline.)

Preferred

- Excellent English proficiency (capable of business communication) - Proficiency in programming languages ​​such as Python is preferred - Highly motivated individual with a strong desire to develop new display and semiconductor substrate products, new materials, and new manufacturing processes

Etc

Majors Chemistry (Engineering), Materials Science, Electrical & Electronic Engineering, Mechanical Engineering, etc. Work Location Gumi Number of Personnel 0 * The entire internship program is conducted in Korean. Please complete your application form in Korean. * The order and schedule of the selection process are subject to change depending on company circumstances. In the event of any changes, we will notify selected candidates separately.

Preferred Visas

Cover Letter

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