2026 Global Internship - CTO Division H/W Development - Semiconductor Package Substrate (International students from domestic universities. Bachelor's, Master's, and Ph.D.)

Job Description

Substrates for semiconductor packaging have evolved from lead frames through ceramics to the current organic substrates, which have been in use for over 20 years. Recently, driven by the advancement of semiconductors and the need for performance enhancement, the development of glass core substrates is accelerating. This is not only to improve performance through the development of front-end semiconductor process technologies but also to overcome the limitations of existing substrates. This role offers specialized experience in the field of glass core substrates, enabling entry into the next-generation substrate sector. - Development of Core Technologies for Semiconductor Packaging Substrates * Research on AI semiconductor packaging and development of design technologies based on Interposer Adv. PKG (OSAT) * Development of Laser & Etching methods, Glass Seed formation methods, and TGV Cu Filling methods for Through Glass Via (TGV) * Development of build-up processes on glass cores (glass crack prevention technology) and glass substrate inspection methods * Development of high-performance glass core material compositions and manufacturing processes, as well as glass lens optical design and performance prediction calculations * Research on glass crack analysis and plating solutions (electroless/electrolytic)

Qualifications

- Experience in Fan-out, WLP/PLP, and FC-BGA design - Master's degree or higher in Mechanical Engineering or Materials Science - Theoretical understanding of the mechanical behavior and fracture mechanisms of brittle materials (Glass, Ceramic) - Master's degree or higher in Chemistry or Chemical Engineering with a systematic understanding of the chemical structure and properties of inorganic materials - Research on Glass-based etching process design and reaction mechanism characteristics - Analysis research based on etchant concentration, reaction temperature, and time variations - Foreign nationals or foreign citizens currently enrolled in or holding a bachelor's degree (3rd year or higher) or master's/doctoral degree at a domestic university (graduates and those expected to graduate in August 2026 are eligible to apply) - Holders of the Test of Proficiency in Korean (TOPIK) Levels 4–6 ※ Valid for 2 years - Holders of or capable of acquiring a visa status for the internship (July–August 2026) (D-2, D-10, F-series visa, etc.) - Government-sponsored Foreign Student Scholarship (GKS), Preference given to those who have completed Level 5 of the Korean Inclusive Social Integration Program (KIIP). - Preference given to candidates with excellent language skills (business communication proficiency): English, Vietnamese, Chinese, Spanish, Polish, Indonesian, etc. ※ Due to the high volume of applications and inquiries on the announcement deadline, please complete your submission before the deadline if possible. Additional registrations and modifications are not possible after the registration deadline, so please ensure you submit well in advance. (Please complete any registration-related inquiries at least 3 days prior to the deadline.)

Preferred

- Holder of a Master's degree or higher - Experience in developing TGV formation technology, Cu seed/filling technology, and glass surface treatment/circuit formation technology

Etc

Majors Chemistry (Engineering), Materials Science, Electrical & Electronic Engineering, Mechanical Engineering, etc. Work Location Gumi Number of Personnel 0 * The entire internship is conducted in Korean. Please complete your application form in Korean. * The order and schedule of the selection process are subject to change depending on company circumstances. In the event of any changes, we will notify selected candidates separately.

Preferred Visas

Cover Letter

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